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NC254 paste flux is a mildly activated, resin-based formulation developed to offer a broad process window and pin-probeable residues. The superior wetting ability of NC254 results in bright, smooth, shiny, solder joints.
NC254 offers very low post process residues, which remain crystal clear and probable even at the elevated temperatures required for today's lead free alloys. NC254 has shown to reduce or eliminate voiding under micro- BGAs. NC254 also offers high humidity tolerance and a chemistry developed for use in air reflow.
This material has been utilized on various assemblies with RF designs without cleaning; however, the compatibility of flux residues on RF assemblies is strongly dependent upon circuitry design.
* Passes BELLCORE and IPC, and Northern Telecom’s copper mirror test; product testing results available upon request.
When being used for rework, application should be limited to the area being worked. Application via dispense needle, brush or a cotton swab is recommended.
NC 254 paste flux can be cleaned, if necessary, with saponified water or an appropriate solvent cleaner. Please refer to the AIM No-Clean-Cleaner Matrix for a list of suitable cleaning materials.
NC 254 paste flux comes standard in syringes, jars, and cartridges.